Negative resist material for lift-off process "SA Series"
It is an acrylic negative photoresist material suitable for wiring formation using lift-off processes, capable of producing inverted taper shapes and hole patterns.
The "SA Series" is a negative-type resist material that can form an inverse taper shape and hole patterns with the following characteristics: This material is suitable for wiring formation using a lift-off process. ■ Capable of forming thick films: ≦ 20 μm ■ High sensitivity: ≧ 60 mJ/cm² ■ High heat resistance: ≦ 130℃ ■ Can be removed with organic solvents at room temperature *Please feel free to contact us if you have any requests.
- 企業：OSAKA ORGANIC CHEMICAL IND., LTD.
- 価格：Other
